Kernel Metadata Declaration — on demand
ISO 26324 asks a DOI Registration Agency to produce a Kernel Metadata Declaration for every DOI it issues. Give any DOI: its public record becomes a record in the Smart Scholars DOI Metadata Format 1.0, checked against every rule, and declared as the Kernel XML.
✓ Meets every rule of the format
The record below is complete and every controlled value is a DOI Attribute Value Set 2.3 spelling. The Declaration on the right follows DOIMetadataKernel.xsd element by element.
What the DOI identifies
The State-of-the-Art in IC Reverse Engineering
10.46243/jst.2021.v6.i05.pp146-167 · JournalArticle — an article in a journal · Digital · Visual · Language · en
Published 2021-10-29
Part of Journal of Science & Technology · ISSN 2456-5660 · vol. 06 · no. 05 · pp. 146–167
Principal agents
- G Shobha (author → Author)
- B Swetha (author → Author)
- V David (author → Author)
- Longman Publishers (publisher → Publisher)
Also in the record, outside the Kernel: the abstract, the licence, 4 links, 7 references. Source: Crossref (member 25296), registered 2026-09-12, last deposited 2026-09-20.
System metadata — ISO 26324:2025, Annex B · DOI Handbook 10.1
Each element by the standard's name and the Handbook's (in grey), read off the record.
| DOI Name DOI name | 10.46243/jst.2021.v6.i05.pp146-167 |
| Referent Type referentType | Creation |
| Referent Sub-Type referentSubType | JournalArticle — an article in a journal |
| Referent Name(s) referentName(s) | The State-of-the-Art in IC Reverse Engineering (PrincipalTitle, en) |
| Basic Metadata basicMetadata | author: G Shobha author: B Swetha author: V David publisher: Longman Publishers published: 2021-10-29 part of: Journal of Science & Technology · ISSN 2456-5660 · vol. 06 · no. 05 · pp. 146–167 language: en form: Digital · Visual · Language |
| Referent Identifier(s) alternateIdentifier(s) | none besides the DOI |
| Registration Authority registrationAuthorityCode | Crossref — issued by Crossref (member 25296); held here as a copy |
| Created Date issueDate | 2026-09-12 |
| relatedIdentifiers | none needed — the descriptive metadata is in this record |
The record
{
"format": "smartscholars-doi-metadata/1.0",
"doi": "10.46243/jst.2021.v6.i05.pp146-167",
"referent": "Creation",
"type": "JournalArticle",
"structural_type": "Digital",
"modes": [
"Visual"
],
"characters": [
"Language"
],
"titles": [
{
"value": "The State-of-the-Art in IC Reverse Engineering",
"type": "PrincipalTitle",
"lang": "en"
}
],
"identifiers": [
{
"type": "DOI",
"value": "10.46243/jst.2021.v6.i05.pp146-167"
}
],
"agents": [
{
"role": "author",
"name": {
"given": "",
"family": "G Shobha"
},
"sequence": "first"
},
{
"role": "author",
"name": {
"given": "",
"family": "B Swetha"
},
"sequence": "additional"
},
{
"role": "author",
"name": {
"given": "",
"family": "V David"
},
"sequence": "additional"
},
{
"role": "publisher",
"name": {
"org": "Longman Publishers"
}
}
],
"dates": {
"published": "2021-10-29",
"date_type": "PublicationDate",
"online": "2021-10-29"
},
"language": "en",
"container": {
"type": "Journal",
"titles": [
{
"value": "Journal of Science & Technology",
"type": "PrincipalTitle"
}
],
"identifiers": [
{
"type": "ISSN",
"value": "2456-5660",
"medium": "electronic"
}
],
"volume": "06",
"issue": "05",
"pages": {
"first": "146",
"last": "167"
}
},
"links": [
{
"url": "https://www.jst.org.in/index.php/pub/article/view/926",
"return_type": "text/html",
"primary": true
},
{
"url": "https://www.jst.org.in/index.php/pub/article/download/926/853",
"purpose": "text-mining",
"return_type": "application/pdf"
},
{
"url": "https://www.jst.org.in/index.php/pub/article/download/926/2579",
"purpose": "text-mining",
"return_type": "application/xml"
},
{
"url": "https://www.jst.org.in/index.php/pub/article/view/926/853",
"purpose": "similarity-checking"
}
],
"abstract": {
"value": "This paper gives an overview of the place of reverse engi- neering (RE) in the semiconductor industry, and the techniques used to obtain information from semiconductor products. The continuous drive of Moores law to increase the integration levelof silicon chips has presented major challenges to the reverse engineer, obsolescing simple teardowns, and demanding the adoption of new and more sophisticated technology to analyse chips. Hardware encryption embedded in chips adds a whole other level of difficulty to IC analysis. This paper covers product teardowns, and discusses the techniques used for system-level analysis, both hardware and software; circuit extraction, taking the chip down to the transistor level, and working back up through the interconnects to create schematics; and process analysis, looking athow a chip is made, and what it is made of. Examples are also given of each type of RE. The paper concludes with a case study of the analysisof an IC with embedded encryption hardware.",
"lang": "en"
},
"license": {
"url": "https://creativecommons.org/licenses/by/4.0/",
"start": "2021-10-29",
"applies_to": "vor"
},
"references": [
{
"key": "ref1",
"unstructured": "References"
},
{
"key": "ref2",
"unstructured": "James D. A case study: Looking inside Apple's iPod Nano – a teardown to the atomic scale [Internet]. Available from: http://electronics.wesrch.com/Paper/paper_details.php?id=EL1SE1KWRX174&paper_type=pdf&type=author"
},
{
"key": "ref3",
"doi": "10.1109/iedm.2006.346878",
"unstructured": "Nii H, et al. A 45 nm high performance bulk logic platform technology (CMOS6) using ultra-high NA (1.07) immersion lithography with hybrid dual-damascene structure and porous low-k BEOL. In: IEDM 2006 Technical Digest; 2006. p.685-688."
},
{
"key": "ref4",
"unstructured": "Narasimha S, et al. High performance 45 nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography. In: IEDM 2006 Technical Digest; 2006. p.689-692."
},
{
"key": "ref5",
"doi": "10.1109/iedm.2004.1419255",
"unstructured": "Chatterjee A, et al. A 65 nm CMOS technology for mobile and digital signal processing applications. In: IEDM 2004 Technical Digest; 2004. p.665-668."
},
{
"key": "ref6",
"unstructured": "International Technology Roadmap for Semiconductors. 2005 ITRS: Metrology section; 2005."
},
{
"key": "ref7",
"doi": "10.1063/1.2062965",
"unstructured": "Vartanian V, et al. Metrology challenges for 45 nm strained-Si devices. In: 2005 International Conference on Characterization and Metrology for ULSI Technology; 2005."
}
],
"record": {
"registrant": "Longman Publishers",
"registered": "2026-09-12",
"updated": "2026-09-20",
"issue_number": 1,
"source": "crossref-api",
"source_agency": "Crossref (member 25296)"
}
}The Kernel Metadata Declaration
DOIMetadataKernel.xsd · namespace http://www.doi.org/2010/DOISchema · Attribute Value Sets 2.3 · draft — the agency's DOI name is filled in on accreditation
<?xml version="1.0" encoding="UTF-8"?>
<!-- DRAFT declaration: Smart Scholars is not yet a DOI Registration Agency. registrationAgencyDoiName is a marker (10.0/ is no RA's prefix) and is filled in on accreditation. -->
<kernelMetadata xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.doi.org/2010/DOISchema https://www.doi.org/doi_schemas/DOIMetadataKernel.xsd" xmlns="http://www.doi.org/2010/DOISchema">
<referentDoiName>10.46243/jst.2021.v6.i05.pp146-167</referentDoiName>
<primaryReferentType>Creation</primaryReferentType>
<registrationAgencyDoiName>10.0/smart-scholars-draft</registrationAgencyDoiName>
<issueDate>2026-10-04</issueDate>
<issueNumber>1</issueNumber>
<referentCreation>
<name primaryLanguage="en">
<value>The State-of-the-Art in IC Reverse Engineering</value>
<type>PrincipalTitle</type>
</name>
<identifier>
<nonUriValue>10.46243/jst.2021.v6.i05.pp146-167</nonUriValue>
<uri returnType="text/html" doesContentNegotiation="true">https://doi.org/10.46243/jst.2021.v6.i05.pp146-167</uri>
<type>DOI</type>
</identifier>
<identifier>
<uri returnType="text/html">https://www.jst.org.in/index.php/pub/article/view/926</uri>
<type>URI</type>
</identifier>
<identifier>
<uri>https://www.jst.org.in/index.php/pub/article/download/926/853</uri>
<type>URI</type>
</identifier>
<identifier>
<uri returnType="application/xml">https://www.jst.org.in/index.php/pub/article/download/926/2579</uri>
<type>URI</type>
</identifier>
<identifier>
<uri>https://www.jst.org.in/index.php/pub/article/view/926/853</uri>
<type>URI</type>
</identifier>
<structuralType>Digital</structuralType>
<mode>Visual</mode>
<character>Language</character>
<type>JournalArticle</type>
<principalAgent>
<name>
<value>G Shobha</value>
<type>PrincipalName</type>
</name>
<role>Author</role>
</principalAgent>
<principalAgent>
<name>
<value>B Swetha</value>
<type>PrincipalName</type>
</name>
<role>Author</role>
</principalAgent>
<principalAgent>
<name>
<value>V David</value>
<type>PrincipalName</type>
</name>
<role>Author</role>
</principalAgent>
<principalAgent>
<name>
<value>Longman Publishers</value>
<type>PrincipalName</type>
</name>
<role>Publisher</role>
</principalAgent>
<linkedCreation>
<name>
<value>Journal of Science & Technology</value>
<type>PrincipalTitle</type>
</name>
<identifier>
<nonUriValue>2456-5660</nonUriValue>
<type>ISSN</type>
</identifier>
<referentCreationRole>Part</referentCreationRole>
<referentCreationSequenceIdentifier>
<value>06</value>
<type>VolumeNumber</type>
</referentCreationSequenceIdentifier>
<referentCreationSequenceIdentifier>
<value>05</value>
<type>IssueNumber</type>
</referentCreationSequenceIdentifier>
<referentCreationSequenceIdentifier>
<value>146-167</value>
<type>PageNumber</type>
</referentCreationSequenceIdentifier>
</linkedCreation>
<language>en</language>
<languageOfReferentContent>
<language>en</language>
<languageOfReferentContentType>Original</languageOfReferentContentType>
</languageOfReferentContent>
<creationDate>
<date>2021-10-29</date>
<creationDateType>PublicationDate</creationDateType>
</creationDate>
</referentCreation>
</kernelMetadata>
